- Sales hotline
+86-512-62653308
No.6 Qingqiu Street, Industrial Park,
Suzhou, Jiangsu Province, China.
Laser power:15W(355nm)/50W(1064nm)
Processing width:4inch、5inch、6inch
Dimension:1000mm*1300mm*1868mm
Cutting material and thickness:
Line width:
Maximum scribing depth:
Repetitive positioning accuracy:±10μm
Industry application: mainly for marking, slotting and cutting of special-shaped wafers in semiconductor industry
Silicon Wafer Cutting Machines—FLC/UVLC Series Characteristic parameter
Equipment model | QL-UVLC15 | QL-FLC50 |
Laser wavelength | 355nm | 1064nm |
laser power | 15w | 50w |
Maximum cutting thickness | 120μm | 200μm |
Scribe width | 20-30μm | 40-50μm |
Overall accuracy | 20μm | |
Platform positioning accuracy | 5μm | |
Platform repeat positioning accuracy | 2μm | |
Maximum processed wafer size | 6’’ | |
ambient temperature | 20±2℃ | |
ambient humidity | < 60% | |
Machine tool body | Marble | |
Equipment weight | 1200kg | |
Power supply | 220V AC | |
Dimensions | 1300mm*900mm*1650mm |
*All technical parameters shall be subject to the latest technical scheme.