- Sales hotline
+86-512-62653308
No.6 Qingqiu Street, Industrial Park,
Suzhou, Jiangsu Province, China.
Laser power:
Processing width:
Dimension:
Cutting material and thickness:
Line width:
Maximum scribing depth:
Repetitive positioning accuracy:
Detection capability: compatible with 4inch, 5inch and 6inch wafers
Appearance dimension:2000mm*800mm*1600mm
Equipment function: with AOI, OCR and other functions
Defect types: particle, scratch, pit, bump, dirt, etc
Software algorithms: depth neural network algorithm, color contrast, contour recognition, offset detection, template matching, etc
Wafer Appearance Inspection Systems—VDW Series Characteristic parameter
Detection capability: | Compatible with 4inch, 5inch and 6inch wafers; |
Dimensions : | 2000mm*800mm*1600mm |
Equipment function: | Have AOI, OCR and other functions; |
Defect type: | grain(particle )、Scratch(scratch )、Small pit(pit)、Bulge(bump )And dirt, etc; |
Software algorithm: | Depth neural network algorithm, color contrast, contour recognition, offset detection, template matching, character contrast, etc; |
UPH(Hourly capacity): | 40PCS-100PCS; |
*All technical parameters shall be subject to the latest technical scheme.