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Wafer Appearance Inspection Systems—VDW Series

Laser power:

Processing width:

Dimension:

Cutting material and thickness:

Line width:

Maximum scribing depth:

Repetitive positioning accuracy:

Detection capability: compatible with 4inch, 5inch and 6inch wafers

Appearance dimension:2000mm*800mm*1600mm

Equipment function: with AOI, OCR and other functions

Defect types: particle, scratch, pit, bump, dirt, etc

Software algorithms: depth neural network algorithm, color contrast, contour recognition, offset detection, template matching, etc

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Product introduction
The equipment is aimed at the process detection of each process of wafer production such as GPP diode, GPP SCR and TVs. The equipment adopts advanced AI deep learning algorithm and cooperates with high-precision line scan camera to detect various defects of 4inch and 5inch wafers, and automatically generates map, which can be connected to the customer's MES system.
  • Wafer Appearance Inspection Systems—VDW Series
    Intelligent detection
    Independently developed AI detection algorithm, which can detect product appearance defects and product size measurement at the same time.
  • Wafer Appearance Inspection Systems—VDW Series
    Excellent optical solution
    It has a full set of optical configuration modules to provide the best solution according to customer needs.
  • Wafer Appearance Inspection Systems—VDW Series
    Multi piece detection function
    The industrial camera with high frame rate, combined with industrial telecentric lens and high-speed dynamic image acquisition, can complete hundreds of image information acquisition tasks per second.
  • Wafer Appearance Inspection Systems—VDW Series
    High stability
    Full closed loop control system, full monitoring of production process and reliable hardware guarantee.

Wafer Appearance Inspection Systems—VDW Series Characteristic parameter

Detection capability:Compatible with 4inch, 5inch and 6inch wafers;
Dimensions :2000mm*800mm*1600mm
Equipment function:Have AOI, OCR and other functions;
Defect type:grain(particle )、Scratch(scratch )、Small pit(pit)、Bulge(bump )And dirt, etc;
Software algorithm:Depth neural network algorithm, color contrast, contour recognition, offset detection, template matching, character contrast, etc;
UPH(Hourly capacity):40PCS-100PCS;

*All technical parameters shall be subject to the latest technical scheme.

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