- Sales hotline
+86-512-62653308
No.6 Qingqiu Street, Industrial Park,
Suzhou, Jiangsu Province, China.
Laser power:15W(355nm)、20W(1064nm)
Processing width:
Dimension:1200mm*1590mm*1856mm(full-automatic)
Cutting material and thickness:
Line width:20~50μm
Maximum scribing depth:120μm
Repetitive positioning accuracy:±2μm
Industry application: GPP diode,SCR and other wafer scribing and cutting applications in semiconductor industry
Silicon Wafer Dicing Machines—FLD/UVLD Series Characteristic parameter
Equipment model | QL-UVLD15 | QL-FLD20 |
Laser wavelength | 355nm | 1064nm |
laser power | 15w | 20w |
Maximum scribe depth | 80μm | 100μm |
Scribe width | 20-30μm | 40-50μm |
Overall accuracy | 10μm | 10μm |
Platform positioning accuracy | 5μm | 5μm |
Platform repeat positioning accuracy | 2μm | 2μm |
Maximum processed wafer size | 6” | 6” |
Maximum scribing speed | 100mm/s | 200mm/s |
ambient temperature | 20±2℃ | 20±2℃ |
ambient humidity | < 60% | < 60% |
Machine tool body | Marble | Marble |
Power supply | 220V AC | 220V AC |
Dimensions | 1300mm*900mm*1650mm |
*All technical parameters shall be subject to the latest technical scheme.